For high-mix electronics manufacturers, the demand for flexible and rapid production is constantly increasing. To address these evolving needs, Mycronic has developed platforms that seamlessly integrate stencil printing and jet printing, enabling the efficient production of any printed circuit board (PCB) at any speed. The new MYPro S series Stencil Printers are engineered to enhance throughput while maintaining the renowned flexibility and quality inherent in Mycronic’s jet printing and 3D Solder Paste Inspection (SPI) solutions.
The Best of Both Printing Worlds for SMT Lines
Mycronic’s strategic expansion into stencil printing provides a comprehensive solution for Surface Mount Technology (SMT) production, catering to customers with diverse manufacturing strategies and growing production volumes. The MYPro S series stencil printer, when combined with the high-speed MYPro A40 pick-and-place machine and other MYPro assembly solutions, constitutes Mycronic’s fastest full-line solution to date.
When it comes to solder paste application, Mycronic’s Jet Printer excels in flexibility. However, for larger batches and time-sensitive production, the integration of Mycronic’s stencil printers alongside a Jet Printer provides the optimal balance of speed and reliability. This tandem approach leverages the stencil printer’s rapid cycle time for standard paste deposits, while the Jet Printer expertly handles non-standard deposits requiring variable thickness or complex shapes with exceptional speed and precision. Production changeovers are streamlined by simply swapping the stencil and selecting the corresponding jetting program, maximizing efficiency and minimizing downtime.
Introducing the MYPro S Series Stencil Printer
Debuted at Productronica 2023, the MYPro S series stencil printer is built for robustness, accuracy, and user-friendliness. Aligned with the MYPro production philosophy, it is designed for the fastest possible changeovers and incorporates all essential functionalities expected of a modern screen printer.
The MYPro S series features an advanced vision system that ensures precise alignment between the stencil and the PCB, which is critical for high-quality solder paste printing. Furthermore, a climate control system maintains the optimal physical properties of the solder paste, ensuring consistent print quality across different environmental conditions. During the printing process, squeegee pressure is continuously monitored, and any deviations are promptly displayed on the control screen for immediate adjustments, ensuring consistent solder paste deposition. To further enhance quality control, each printed circuit board undergoes 2D inspection to verify the presence of all paste deposits. Following each stencil cleaning cycle, the stencil itself is also 2D inspected to confirm its readiness for continued production. Traceability, a vital requirement for high-reliability electronics manufacturing, is achieved through automated tracking of each stencil, solder paste batch number, and operator ID.
The stencil printer’s robust frame, featuring a marble support beam, provides exceptional rigidity and long-term repeat accuracy of ±8µm. The squeegee movement, driven by a ball-screw with direct servo connection, contributes to consistently high-quality printing over extended periods. The motorized transport rail, equipped with dual guide rails and a dual ball-screw, ensures long-term stability and precise PCB handling throughout the printing process.
Achieving Closed-Loop Quality with PI Series 3D SPI
For even more stringent process control, the MYPro S series screen printer can be seamlessly integrated with Mycronic PI series 3D SPI models. Utilizing optional closed-loop software, the PI series 3D SPI can automatically fine-tune the stencil position in X and Y axes, as well as its rotational angle, based on post-print inspection data. Moreover, if print quality degrades, the 3D SPI system can be configured to automatically initiate a stencil cleaning cycle, ensuring consistent and high-quality solder paste printing in demanding SMT assembly environments.
